(18.188.142.69)
Users online: 9464     
Ijournet
Email id
 

International Journal of Engineering and Management Research (IJEMR)
Year : 2017, Volume : 7, Issue : 4
First page : ( 340) Last page : ( 345)
Print ISSN : 2394-6962. Online ISSN : 2250-0758.

Performance of Water and Diluted Ethylene Glycol as Coolants for Electronics Cooling

Sekhar P. Chandra, Sekhar M. Chandra, Rao G. Uma Maheswara

Department of Mechanical Engineering, India

Online published on 31 October, 2017.

Abstract

The electronic components have been ruling the world since few decades. Heat dissipation in the electronic components is being a critical issue with the development of chip integrated circuits. Gradual decrease in size of the components has resulted in drastic increase of the amount of heat generation per unit volume. In the present work copper tubes brazed on a copper plate is used as heat sink having overall dimension 38×38×2.5mm. Diluted Ethylene glycol at volume fraction of 40% and pure water are used as cooling fluids. The surface temperature of the heated aluminum block is tested at different flow rates of water and diluted ethylene glycol. The temperature of the block is maintained below 45°c when water is used. The convection heat transfer coefficient of water flowing through the copper tubes is increased with increasing the flow rate is observed. Pump power is calculated at each flow rate of water and Ethylene glycol. In the present work

Top

Keywords

Electronics cooling, Diluted Ethylene glycol, pump power.

Top

  
║ Site map ║ Privacy Policy ║ Copyright ║ Terms & Conditions ║ Page Rank Tool
750,471,439 visitor(s) since 30th May, 2005.
All rights reserved. Site designed and maintained by DIVA ENTERPRISES PVT. LTD..
Note: Please use Internet Explorer (6.0 or above). Some functionalities may not work in other browsers.